Welcome to ProtoMEMS

Nano-Bio
 
Multiplex Assays, FlashGel  Electrophoresis, PCR Thermal Cycling, Cell Culturing/Incubation, Glove Box, Chilled Work Space, Freeze Drying, Autoclave, Centrifuge, Cell Counting
Resist Processing Spin & Spray
 
OiR 620-7i, S1800 Series, SPR220 Series, SPR700 Series, SPR955CM, STR1045/1075, ARC, UV210, AZ9260, AZ nLOF, SU8, Polyimide, BCB, KMPR, LOR, ProTEK SR25 & Others
Dry Etching
 
RIE, ICP and DRIE using: CHF3O2, CHF3Ar, CF4, SF6O2, SF6C4F8, Cl2, BCl3, XeF2 and Others with Full Control over RF/ICP Power, Chamber Pressure, Temperature and Gas Flowrates
Wet Etching/Chemistry
 
KOH, TMAH, HF, BOE, Gold Etch, Aluminum Etch, Copper Etch, Chrome Etch, Titanium Etch, Pad Etch, Aqua Regia, HCL, Nitric, Sulfuric, Phosphoric, Hot Piranha, Hot Nanostrip and Others
Thin Film Deposition
 
Evaporation (Ebeam, Thermal), Sputter Deposition (DC& RF), PECVD, Atomic Layer Deposition, Molecular Vapor Deposition, Pulsed Laser Deposition, Conductive Polymer Vapor Deposition
Test & Metrology
 
Stress, PH, Thickness, Refractive Index, Transmission,/Absorption/Reflection, Step Height, Surface Roughness, Contact Angle, Viscosity, ZetaPotential, Resistivity, Molecular Weight, FTIR
Furnace Processing
 
Thermal Oxidation (Wet & Dry), LPCVD Nitride, LTO and HTO, Poly-Silicon, Annealing (All Types), Doping (Boron, Phosphorus & POCl3)
Microscopy
 
Dark Field, Bright Field, Inverted, Polarized Light, Stereoscopic, DIC, Confocal, Fluorescence, TIRF, AFM, SEM and STEM including Sample Prep (Cutting, Polishing, Coating, Staining)
Mask Layout/Design/Exposure
 
CAD Layout & Design(Multiple Levels with Alignment Marks, Verniers, Test Structures, etc), Mask Exposure (Laser Writer & Pattern Generator), Mask Develop/Etch/Strip
Wafer Bonding
 
Cleaning (RCA) & Surface Activation, Fusion Bonding, Adhesive Bonding, Anodic Bonding, Eutectic Bonding, Water Bonding, Furnace Annealing, Bond Strength Testing & Other
Ion Implantation & Activation
 
Implantation Screening, Ion Implantation (with Arsine, Phosphine, Boron Trifluoride, Carbon Dioxide, Argon & Helium sources), Thermal Activation (Furnace, RTA & RTP)
Lithography:Contact & Stepper
 
Contact Aligners (MA6, EV620 and ABM), Optical Steppers (i-Line & g-Line), Deep UV Stepper (ASML), Whole Wafers, Chips, Temporary Handle Wafers All Possible
Other Services
 
Electroplating (Au, Cu, Ni and Other), Critical Point Drying, IV Probe Station, Zyvex NanoProbe Station, Wire Bonding, Soft Lithography (PDMS Casting and Bonding), Parylene, Nanoimprint &Other
Carbon Nanotubes & Graphene
 
First Nano ET3000 Carbon Nanotube/Graphene Furnace with Hydrogen and Methane Ambient (Samples up to 100mm Diameter), Manual Tube Furnace, Seed Liftoff
Electron Beam Lithography
 
JEOL6300 and JEOL9300 Ebeam Lithography Systems using PMMA, MMA, ZEP520A, ZEP7000, NEB 31A3, ma-N 2403, XR1541 (HSQ), UV56, UVN30 and Others, Bilayer & Trilayer
Dicing, Drilling, Milling &Other
 
Wafer Dicing, Chemical Mechanical Polishing, Diamond Film Polishing, Wafer Drilling, Powder Blasting, Abrasive Water Jet, Wiresaw, Glasswork, Laser Ablation, Focused Ion Beam, Ion Milling and Other